Our Microscopy Lab serves as a central hub for material characterization, offering in-depth insights into the microstructure of materials. Through state-of-the-art imaging and analysis techniques, we provide a detailed understanding of how microstructural features impact material performance and influence processing. This comprehensive analysis is essential for advancing research and industrial applications, allowing us to optimize materials for a wide range of cutting-edge technologies.

Several optical microscopes are available; the most upgraded version is Olympus DSX.

  • Supplier & Model: Olympus / DSX1000 High-End model
  • Testing methods: High res. and long working distance in one objective. Six observation methods: BF, DF, DIC, POL, OBQ right and left.
  • 5 different objectives
  • Motorized stage
  • Tilting option for various imaging options

MIPAR software is available for image analysis

Hardware:

  • TESCAN Mira 4th generation - Variable pressure
  • Electron Backscatter Diffraction (EBSD); Hikari Plus (up to 1000 indexed points/sec)
  • Energy Dispersive Spectrometry (EDS); Octane Elect (res. 127 eV for Mn)
  • Wavelength Dispersive Spectroscopy (WDS); TEXS HP
  • BSE detector motorized
  • In-beam SE
  • Plasma Cleaning system
  • In-situ tensile/compression/heating stage, adaptable for in-situ EBSD applications (up to 5kN and 800°C) + extensometer; K&W

Software packages:

  • Essence full package
  • TEAM complete package + Particle analysis; EDAX
  • TSL-OIM complete package

Hardware:

  • TESCAN Lyra3 GMU - Variable pressure
  • Electron Backscatter Diffraction (EBSD); Hikari Super (up to 1200 indexed points/sec)
  • Energy Dispersive Spectrometry (EDS); Octane Plus (res. 127 eV for Mn)
  • Wavelength Dispersive Spectroscopy (WDS); TEXS HP
  • Scanning Transmission Electron Microscopy (STEM); BF,DF, HADF (res. down to 0.8 nm)
  • Focused Ion Beam (FIB); COBRA (res. down to 2.5 nm)
  • 4 Quadrant Backscatter Solid State Detector (4QBSE)
  • Water-cooled BSE detector; for in-situ high temperature applications
  • Nanomanipulator; Oxford OmniProbe200
  • Beam Deceleration Mode; for low kV applications
  • In-beam BSE; In-beam SE
  • Low vacuum SE
  • Plasma Cleaning system
  • Field Cancellation System
  • In-situ tensile/compression/heating stage, adaptable for in-situ EBSD applications (up to 5kN and 800°C) + extensometer; K&W

Software packages:

  • Advanced tomography
  • Automated TEM lamella preparation
  • MeX Professional 3D surface imaging; Alicona
  • 3D reconstruction; ORS Visual
  • TEAM complete package + Particle analysis; EDAX; 2D and 3D
  • TSL-OIM complete package
  • CORAL for correlative microscopy

For topography and chemical potential measurements + nano-indentation

  • Supplier & Model: Park / Nx40
  • Type of Material for testing: metals, coatings; flat and max 20 mm height
  • Testing methods: surface morphology (contact and non-contact), SKFM, nanoindentation, coupling with electrochemical cell for morphological studies under polarization in liquid
  • Others: Max. 15 micron z range

Fully automated argon ion polishing - Broad Ion Beam (BIB) milling

  • Supplier & Model: Gatan / PECS II
  • Type of Material for testing: all
  • Testing methods: Precision milling of up to 1 cm in diameter, cross-secitoning of thin films and coatings, sputter coating for Carbon or Chromium
  • Temperature range: RT down to -20C
  • Sputter coating resolution of 0.1 nm

Fully automated argon ion polishing - Broad Ion Beam (BIB) milling

  • Supplier & Model: Kammrath & Weiss / 5kN module
  • Type of Material for testing: all
  • Testing methods: Tensile/Compression/Cyclic loading for up to 5 kN loading, up to 20 um/s withdrwal rate
  • Temperature range: RT up to 800C
  • Compatible for in-situ EBSD testing (tilted)