Surface Treatment

Our laboratory offers specialized facilities for electrochemical surface treatments of metallic materials, with a focus on plating and anodizing. These facilities are designed to support both academic research and industrial collaboration, ranging from small-scale experiments to pilot-scale studies. In all cases, we design the deposition cell to accommodate proper cathode/anode geometrical design, temperature automatic control, and customized agitation systems (stirring, bubbling, cathodic motion, ultrasounds).

• Plating
  We are equipped with DC and pulse plating rectifiers covering a wide range of operating conditions:
  • 0–5 A systems for high-resolution, low-current control in research on fine structures and coatings.
  • Up to 60 A for processing large areas and pilot-scale trials.
    In addition, we have the flexibility to design and operate custom pilot line set-ups, with bath volumes of up to 200 liters, enabling process development, scale-up studies, and application-specific investigations.
  • Capability to deposit micro and nanocomposite metallic layers
• Anodizing
  Our anodizing capabilities are currently focused on small-scale experimental setups, ideal for developing new methods, studying anodized layer formation, and investigating the influence of processing parameters on functional surface properties.

With these facilities, we aim to combine scientific exploration—such as understanding deposition mechanisms, microstructure development, and surface performance, developing new coating systems and new deposition bath formulations—with practical applications, including the optimization of industrial processes and the evaluation of new materials and treatments.

Relevant characterization facilities: Corrosion and electrochemical testing